There is a growing demand for higher-density NAND flash across the global storage market. For the time being, this demand has been satisfied through many developments, not only in the capabilities of ...
Micron and Intel are officially splitting up, dumping their joint NAND flash manufacturing activities, and fighting over custody of the the family dog, Moore. The first thing Micron has done with its ...
For years, many have predicted the end of flash memory scaling, particularly NAND, but the technology continues to defy the odds as it moves down the process curve. Still, there are signs that the ...
Released every 12 to 18 months, 3D NAND scaling outpaces most other semiconductor devices in replacement rate and performance ...
Taipei, Taiwan — Looking to snatch back its mantle as NAND flash leader, Samsung Semiconductor trotted out a 32-Gbit chip made on 40-nanometer process technology last week that eliminates the ...
Micron Technology recently unveiled 176-layer, triple-level-cell (TLC), 3D NAND flash memory with a 30% smaller die size that employs a new replacement-gate (RG) NAND technology. The chips offer a 35% ...
Micron's new fifth-generation 176-layer 3D NAND flash is the same height as its 64-layer memory, but packs in 2.75 times more layers in the same space--a space that's 30% smaller than today's leading ...
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