With the trend from Si IGBT to SiC MOSFET in electric vehicle (EV) power electronics, the junction temperature is expected to increase from 150°C to 175°C with the potential to exceed 200°C. This ...
The cost of Ag sintering can vary significantly based on factors like customer relationships, order volumes, and suppliers. Ag sintered paste costs can easily be five to ten times higher than solder ...
Die attach materials form the cornerstone of reliable power electronic packaging, providing the essential bond between semiconductor devices and their substrates. Recent advances have focused on ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback