Semiconductor Engineering

Thermal-Mechanical Optimization of 2.5D Flip-Chip Packages With Glass and Silicon Interposers (Univ. of Ottawa)

A new technical paper titled “Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via ...
Geeky Gadgets

Samsung Galaxy Z Flip 8’s 2nm Secret: Why Samsung is Making a Custom Snapdragon

Samsung is reportedly collaborating with Qualcomm to develop a customized version of the Snapdragon 8 Elite Gen 5 chip, using Samsung’s advanced 2-nanometer SF2 process. This partnership aims to ...
Android Authority

Galaxy Z Flip 7 tipped to introduce Samsung’s next-gen Exynos chip

A new report strongly suggests that the Exynos 2500 will debut in the Galaxy Z Flip 7. Most regions will apparently get the Exynos chip, while the US, China, and Canada will stick with Snapdragon.
Android

Galaxy Z Flip 7 Chip Shocker: US Model Tipped for Exynos, Not Snapdragon

The Samsung Galaxy Z Flip 7 in the US might feature an Exynos 2500 chip, departing from its usual Snapdragon standard. This potential shift is likely driven by thermal management challenges in the ...