How a Niche Technology Became a Choke Point for A.I.

Advanced chip packaging, which boosts computing power for artificial intelligence, has made the United States more reliant on ...

TSMC targets 2029 for panel-level CoPoS packaging in AI chip push - DigiTimes

Taiwan Semiconductor Manufacturing (NYSE:TSM) is accelerating development of a next-generation AI chip packaging technology called CoPoS that shifts production from round 12-inch wafers to 310mm x ...

Elon Musk Praises Tesla's 'Awesome' AI Chip Team, Says AI6 May Set New Wafer Intelligence Record

Elon Musk said Tesla Inc.'s upcoming AI6 chip could set a record for "usable intelligence" produced from each semiconductor wafer, highlighting the company's effort to pair raw computing power with ...

IBM Says It Has Found a Way to Keep Shrinking the Technology Inside Chips

Industry leaders had worried that innovations in chip miniaturization were no longer possible. By Don Clark Reporting from ...
TechSpot

The microchip era may be ending – and wafer-scale systems could be what comes next

Forward-looking: The engine of the digital age is running up against the laws of physics. Modern semiconductors, the microscopic foundations of computing, are nearing their physical limits just as ...
VentureBeat

Cerebras' wafer-size chip is 10,000 times faster than a GPU

Cerebras Systems and the federal Department of Energy's National Energy Technology Laboratory today announced that the company's CS-1 system is more than 10,000 times faster than a graphics processing ...

IBM Unveils World’s First Sub-1-Nanometer Chip Technology

In a major breakthrough, IBM revealed the world’s first semiconductor chip technology built on a sub-1 nanometer chipmaking ...