Multi-die designs leveraging 2.5D and 3D technologies are becoming crucial for various electronics applications, including high-performance computing (HPC), artificial intelligence (AI), automotive, ...

Although multi-die designs — an increasingly popular approach for integrating heterogeneous and homogenous dies into a single package — help resolve problems related to chip manufacturing and yield, ...

Multi-die system or chiplet-based technology is a big bet on high-performance chip design—and a complex challenge. In partnership withSynopsys To say that semiconductor technology is part of the ...

What makes up a multi-die/chiplet system? What’s driving demand for multi-die systems? The challenges of multi-die system design. Demands have never been higher for—and on—semiconductors. From smart ...