What makes up a multi-die/chiplet system? What’s driving demand for multi-die systems? The challenges of multi-die system design. Demands have never been higher for—and on—semiconductors. From smart ...

Cadence is also collaborating with Samsung Foundry to build out a silicon prototype demonstration of the Cadence Physical AI ...

Abhijeet Chakraborty, Vice President of Engineering at Synopsys, presented one of the keynote speeches at the 2024 Chiplet Summit (watch the video above). Mr. Chakraborty noted that 2023 was an ...

CAMPBELL, Calif., June 17, 2025 (GLOBE NEWSWIRE) -- In a market reshaped by the compute demands of AI, Arteris, Inc. (AIP), a leading provider of system IP for accelerating semiconductor creation, ...

Chiplet Summit, the premier global event focused on chiplet-based design and integration, has extended the nomination ...

Forbes contributors publish independent expert analyses and insights. Marco Chiappetta is a technologist who covers semiconductors and AI. The Universal Chiplet Interconnect Express Consortium was ...

Baya Systems, a chip technology company that wants accelerate intelligent computing, raised $36 million in funding. Maverick Silicon led the round, which also included strategic investment from ...

Chiplets enable scalability but dramatically raise interconnect complexity and risk. Silicon-proven NoC technology is the key ...

From generative AI tools that rapidly produce chatbot responses to high-performance computing (HPC) applications enabling financial forecasting and weather modeling, it’s clear we’re in a whole new ...

Monolithic chips have been the workhorses behind decades of technological advancement. But just as the industrial revolution saw workhorses replaced with more efficient and powerful machinery, the ...

System-on-chip design startup Baya Systems Inc. said today it has closed on $36 million fuding to support its operational growth and accelerate the development of its software portfolio to meet the ...