Startup Substrate is building next-generation semiconductor fabs using advanced X-ray lithography. This goes beyond extreme ...
The 300mm silicon carbide wafer targets higher production capacity for power electronics and advanced system integration.
SPHBM4 cuts pin counts dramatically while preserving hyperscale-class bandwidth performanceOrganic substrates reduce packaging costs and relax routing constraints in HBM designsSerialization shifts ...
Germanium quantum dots (QDs) on silicon substrates represent a cutting‐edge research field that bridges the disciplines of semiconductor physics and nanotechnology. The self‐assembled formation of ...
A group of scientists at Zhejiang University in China has developed a perovskite-silicon tandem solar cell that utilizes textured silicon substrates to improve interface engineering between the top ...
Gallium Phosphide (GaP) epitaxy on silicon substrates represents a critical frontier in semiconductor heterointegration, combining the superior optoelectronic properties of III–V materials with ...
The wish list of device properties that designers of power management systems would like to have is lengthy, but no single material is yet sufficient for the full range of power control applications.
Crystalline quartz films grown on four-inch silicon wafers detect Chikungunya virus at sensitivities surpassing standard ...
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