New York, Nov. 04, 2020 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Global Underfill Materials Industry" - https://www.reportlinker.com ...
Farmington, April 28, 2023 (GLOBE NEWSWIRE) -- The Global Underfill Market Was Valued At USD 357.8 Million In 2022 And Is Expected To Expand USD 846.9 Million By 2030 at a CAGR Of 8.99% From 2022 To ...
Master Bond has formulated a line of one component epoxy underfill compositions which feature rapid cures at moderately elevated temperatures and offer excellent underfill-to-die passivation as well ...
YINCAE, a leading innovator in advanced materials solutions, today announced the launch of its groundbreaking underfill material, UF 158UL. This cutting-edge product is designed to meet the increasing ...
Master Bond EP3UF is a one component, low viscosity epoxy for bonding and underfill applications. It has good flow properties and is easily cured at elevated temperatures as low as 250°F. It is not ...
CN-1736 is a reworkable underfill designed for use with 0.4-mm-pitch package-on-package (POP) assemblies. With low viscosity, lower coefficient of thermal expansion (CTE) than previously, and greater ...
Flip chip packaging represents a cutting‐edge assembly technique in which semiconductor devices are mounted upside‐down, enabling direct connection to the substrate via solder bumps. This method not ...
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