STMicroelectronics introduces the first automotive microcontroller with AI acceleration for edge intelligence Stellar P3E automotive microcontroller (MCU) enables real-time AI applications at the edge ...

Nationwide stood out in our review for customer service. It earned the highest score on our Consumer Sentiment Index and has ...

Bonds and interconnects are especially problematic and require more test insertions. Ensuring reliability requires connecting fragmented data that is often siloed. The shift to multi-die assemblies is ...

The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV process steps, which include lithography patterning followed by deep reactive ion ...

Bybit, the world's second-largest cryptocurrency exchange by trading volume, is calling traders across the TradFi and crypto divide to come together ...

Abstract: In recent years, there has been increasing adoption of FPGAs in datacenters as hardware accelerators, where a large population of end users are software developers. While high-level ...

Patients with duplicate medical records are five times more likely to die after being admitted to hospital and three times ...

With a clock speed bump and... not much else, the AMD Ryzen 7 9850X3D still manages to impress as the fastest gaming CPU ...

Mars has captured humanity’s imagination for decades, but the reality is far darker than the dream. The planet offers no air, no protection, and no forgiveness for mistakes. Every solution depends on ...

Abstract: This paper delves into the innovative application of quantum computing to solve complex multi-die FPGA (FieldProgrammable Gate Array) routing challenges. Leveraging the Quantum Approximate ...

MiniCPM-V is a series of end-side multimodal LLMs (MLLMs) designed for vision-language understanding. The models take image, video and text as inputs and provide high-quality text outputs. Since ...