A team of archaeologists from the Universitat Jaume I, the University of Barcelona, and the Catalan Institution for Research and Advanced Studies (ICREA) has developed a new methodology that allows ...
Highlights amino acid analysis of rice and millets using a high-speed amino acid analyzer with a protein hydrolysate method, supporting nutritional characterization. Miscellaneous grains have more ...
The European Commission said Friday it was fining Elon Musk’s social media app X with the equivalent of $140 million, saying that it had breached the bloc’s digital rulebook — a move that will likely ...
To ensure the viability of bacteria in the biomineralization process for crack filling and healing, protection from the heat (generated by cement hydration) and the retraction (during hardening) of ...
New research reveals how genetic changes in the barley MKK3 gene fine-tune seed dormancy, determining whether grains stay dormant or sprout too soon. The findings offer breeders new genetic tools to ...
Abstract: Mud deposits in cold water masses (CWMs) on continental shelves represent distinct units of suspended particulate matter (SPM); however, the generative mechanism and variation in SPM during ...
Artificially low interest rates have stimulated investment into AI that has hit scaling limits, says research firm It's not just a bubble but an epically sized one, an analyst argues. For good reason, ...
LAS VEGAS — Minnesota Lynx coach Cheryl Reeve’s outburst about officiating after Napheesa Collier’s injury in Game 3 of the WNBA semifinals and her subsequent Game 4 suspension has cost her a fine of ...
Reddit user Karmyuh has produced one of the first major works of Silksongology: A direct size comparison of Pharloom and Hallownest, taking into account that Silksong's world has been scaled up to ...
Milliman estimates that plans’ aggregate funding improved by $26 billion in the first half of 2025, moving from a $23 billion shortfall at year-end 2024 to a $3 billion surplus as of June 30, 2025.
Abstract: With the continuous scaling of the IC dimensions, fabricating interconnections for heterogeneous integration has become increasingly challenging. Various Cu microstructures, such as ...